Chair: Helen Mulvana, University of Glasgow
Co-Chair: Adrian Basarab, University of Lyon

Dan Adam, Technion IIT
Mototaka Arakawa, Tohoku University
Mike Averkiou, University of Washington
Kenneth Bader, University of Chicago
Lokesh Basavarajappa, Indian Institute of Technology Indore
Carolyn Bayer, Tulane University
Muyinatu Bell, Johns Hopkins University
Deep Bera, GE Healthcare
Mark Borden, University of Colorado Boulder
Ayache Bouakaz, INSERM
Lori Bridal, CNRS at Sorbonne University
Matthew Bruce, University of Washington
Michal Byra, Polish Academy of Sciences
Ewen Carcreff, TPAC
Stefan Catheline, INSERM LabTAU
Jin Ho Chang, DGIST
Hong Chen, Washington University in St. Louis
Shigao Chen, Mayo Clinic
Yinran Chen, Xiamen University
Parag Chitnis, George Mason University
Magnus Cinthio, Lund University
Guy Cloutier, University of Montreal
Olivier Couture, CNRS at Sorbonne University
Christian Coviello, Verasonics Inc
Yaoyao Cui, Suzhou Institute of Biomedical Engineering and Technology
Jeremy Dahl, Stanford University
Paul Dayton, University of North Carolina/NCSU
Chris de Korte, Radboud University Medical Center
Stefanie Dencks, uhr-University Bochum
Cheri Deng, University of Michigan
Tommaso Di Ianni, University of California San Francisco
Marvin Doyley, University of Rochester
Yonina Eldar, Weizmann Institute of Science
Stanislav Emelianov, Georgia Institute of Technology and Emory University
Lin Fanglue, United Imaging
Mostafa Fatemi, Mayo Clinic
Brian Fowlkes, University of Michigan
Steven Freear, University of Leeds
Caterina Gallippi, University of North Carolina
Orcun Goksel, Uppsala University
Fei Gao, Hybrid Imaging System Lab
Damien Garcia, INSERM
Aiguo Han, Virginia Tech
Emma Harris, Institute of Cancer Research
Hideyuki Hasegawa, University of Toyama
Chih-Chung Huang, National Cheng Kung University
Safeer Hyder, Siemens Healthineers
Tali Ilovitsh, Tel Aviv University
Kazuyo Ito, Tokyo University of Agriculture and Technology
George Kapodistrias, Samsung Research America
Jeff Ketterling, Weill Cornell Medicine
Kang Kim, University of Pittsburgh
Michael Kolios, Ryerson University
Elisa Konofagou, Columbia University
Klazina Kooiman, Thoraxcenter Erasmus MC
Denis Kouamé, U Paul Sabatier Toulouse
Nobuki Kudo, Hokkaido University
Arun Kumar Thittai, Indian Institute of Technology Madras
Cyril Lafon, INSERM LabTAU
Roberto Lavarello, Pontificia Universidad Católica del Perú
Wei-Ning Lee, University of Hong Kong
Meng-Lin Li, National Tsing Hua University
Pai-Chi Li, National Taiwan University
Tong Li, United Imaging Ultrasound Business Unit
Hervé Liebgott, University of Lyon
Jingfei Liu, Texas Tech University
Richard Lopata, Eindhoven University of Technology
Thanasis Loupas, Philips Ultrasound
Lasse Lovstakken, Norwegian University of Science and Technology
Geoff Luke, Dartmouth College
Jianwen Luo, Tsinghua University
João Machado, University of Rio de Janeiro
Jonathan Mamou, Weill Cornell Medicine
Giulia Matrone, University of Pavia
Mami Matsukawa, Doshisha University
Valentino Meacci, University of Florence
Bob McGough, Michigan State University
Mohammad Mehrmohammadi, University of Rochester
Kristen Meiburger, Politecnico di Torino
Karla Mercado-Shekhar, Indian Institute of Technology Gandhinagar
Martin Mienkina, GE Healthcare
Jean-Gabriel Minonzio, Universidad de Valparaiso
Massimo Mischi, Eindhoven University of Technology
Larry Mo, Independent Consultant
Pauline Muleki Seya, University of Lyon
Marie Muller, North Carolina State University
Kibo Nam, Thomas Jefferson University
Svetoslav Nikolov, BK Ultrasound
Michael Oelze, University of Illinois
Meaghan O'Reilly, Sunnybrook Research Institute
Virginie Papadopoulou, University of North Carolina at Chapel Hill
Theo Pavan, University of Sao Paulo
Mathieu Pernot, ESPCI Paris
Gianmarco Pinton, University of North Carolina
Jean Provost, École Polytechnique de Montréal
Alessandro Ramalli, University of Florence
Daniel Rohrbach, Verasonics
Yoshifumi Saijo, Tohoku University
Ralf Seip, SonaCare Medical LLC
Himanshu Shekhar, Indian Institute of Technology Gandhinagar
Julianna Simon, Pennsylvania State University
Pengfei Song, Duke University
Dean Ta, Fudan University
Kazuki Tamura, Hamamatsu University School of Medicine
Mengxing Tang, Imperial College London
Mickael Tanter, INSERM
Juan Tu, Nanjing University
Matthew Urban, Mayo Clinic
Ton van der Steen, Erasmus Medical Centre
Tomy Varghese, University of Wisconsin
Francois Vignon, Philips Research North America
Mingxi Wan, Xi’an Jiaotong University
Xueding Wang, University of Michigan
Kendall Waters, Siemens Healthineers
Keith Wear, Food and Drug Administration
James Wiskin, QT Ultrasound Inc.
Tao Wu, ShanghaiTech University
Shawn Xiang, UC Irvine
Zhen Xu, University of Michigan
Xiaochen Xu, X Biomedical Microsystems
Tadashi Yamaguchi, Chiba University
Yan Yan, University of Rochester Medical Center
Chih Kuang Yeh, National Tsing Hua University
Shin Yoshizawa, Tohoku University
Alfred Yu, University of Waterloo
Roger Zemp, University of Alberta
Bajram Zeqiri, National Physical Laboratory
Xiaoming Zhang, Mayo Clinic
Yue Zhao, Harbin Institute of Technology
Hairong Zheng, Shenzhen Institutes of Advanced Technology
Xiaowei Zhou, Chongqing Medical University
Yujin Zong, Xi'an Jiaotong University

Chair: Yao Kui, A*STAR, Singapore
Co-Chair: Erdal Oruklu, Illinois Institute of Technology
Co-Chair: Lorenzo Capineri, University of Florence

Arnold Walter, Fraunhofer Institute for NDT
Friend James, UCSD
Gachagan Anthony, University of Strathclyde, Glasgow
Haeggstrom Edward, University of Helsinki
Harley Joel, University of Florida
Hines Jacqueline, Applied Sensor R&D Corporation
Johnston Patrick, NASA Langley Research Center
Kupnik Mario, Technische Universität Darmstadt
Lu Yufeng, Bradley University
Maev Roman, University of Windsor
Nakamura Kentaro, Tokyo Institute of Technology
Ramadas Nishal, Hy-Met Limited, UK
Saniie Jafar, Illinois Institute of Technology
Tittmann Bernhard, Pennsylvania State University
Vetelino John F., University of Maine
Wilcox Paul, University of Bristol
Wright William, University College Cork
Yuhas Donald E., Industrial Measurement Systems
Kobayashi Makiko, Kumamoto University
Rao Jing, Beihang University
Xu Kailiang, Fudan University, Shanghai
Balogun Oluwaseyi, Northwestern University
Baradarani Aryaz, Tessonics Inc, Windsor, Ontario
Pantea Cristian, Los Alamos National Laboratory
Yang Zhengbao, Hong Kong University of Science and Technology
De Marchi Luca, University of Bologna
Philibert Marilyne, IRT Jules Verne
Ravi Adarsh, Analog Devices Inc.
Chen Yun-Sheng, University of Illinois Urbana Champaign
Floer Cécile, Université de Lorraine
Zonzini Federica, University of Bologna
Li Fang, New York Institute of Technology

Chair: Yook-Kong Yong, Rutgers University
Co-Chair: Dave Feld, Skyworks, Inc.

Sajjad Afrakhteh, University of Trento
Badreddine Assouar, University of Lorraine
Javier Brum, Instituto de Física, Facultad de Ciencias, UdelaR
Xiran Cai, ShanghaiTech University
Bingbing Cheng, ShanghaiTech University
Benyamin Davaji, Northeastern University
Ahmed El Kaffas, University of California, San Diego (UCSD)
Itziar Gonzalez, National Research Council of Spain CSIC
Keisuke Hasegawa, Saitama University
Jae Youn Hwang, Daegu Gyeongbuk Institute of Science & Technology
Brice Ivira, Broadcom Ltd
Noe Jimenez, Universitat Politecnica de Valencia (UPV)
Yun Jing, Pennsylvania State University
Takefumi Kanda, Okayama University
Piotr Kiełczyński, Polish Academy of Sciences
Eun Sok Kim, University of Southern California
Hyung Ham Kim, Pohang University of Science and Technology
Chris Kirkendall, Broadcom
Kimmo Kokkonen, Qualcomm Inc.
Amit Lal, Cornell University
John Larson, Broadcom Ltd
Xin Liu, Fudan University
Teng Ma, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences
Marcus Mayer, Qualcomm Inc.
Andreas Mayer, HS Offenburg – University of Applied Sciences, Gengenbach
Mihir Patel, Skyworks Inc.
Laura M. Peralta Pereira, King’s College London
Masaya Takasaki, Saitama University
Ji Wang, Ningbo University
Tingzhong Xu, Silicon Austria Labs GmbH
Yuan Xu, Toronto Metropolitan University
Takahiko Yanagitani, Waseda University
Lei Zhang, Institute of Materials Research and Engineering, A*STAR

Chair: Songbin Gong, University of Illinois at Urbana Champaign
Co-Chair: Amelie Hagelauer, Technical University of Munich

Ben Abbott, Skyworks Solutions, Inc.
Robert Aigner, Qorvo, Inc.
Ausrine Bartasyte, University of Franche-Comté
Paul Bradley, Broadcom Ltd.
Vikrant Chauhan, Qualcomm
Marta Clement, Polytechnic University of Madrid (UPM)
Omar Elmazria, Université de Lorraine
Ken-ya Hashimoto, Chiba University
Shogo Inoue, Qorvo, Inc.
Michio Kadota, Tohoku University
Abhay Kochhar, Akoustis Technologies, Inc.
Jan Kuypers, MEMS2market
Ming-Huang Li, National Tsing Hua University, Hsinchu, Taiwan
Ruochen Lu, University of Texas Austin
Ryo Nakagawa, new affiliation announced soon
Hiroyuki Nakamura, Maxscend Technology JAPAN Corporation
Natalya Naumenko, National University of Science and Technology "MISIS"
Xin Ou, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Tuomas Pensala, VTT Technical Research Centre of Finland
Mauricio Pereira da Cunha, University of Maine
Maximilian Pitschi, Qualcomm / RF360 Europe GmbH
Alexandre Reinhardt, CEA-LETI
Matteo Rinaldi, Northeastern University
Rich Ruby, Broadcom Ltd.
Hagen Schmidt, Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden)
Marc Solal, Qorvo, Inc.
Shuji Tanaka, Tohoku University
Masanori Ueda, TAIYO YUDEN CO., LTD.
Karl Wagner, Qualcomm / RF360 Europe GmbH
Yiliu Wang, Skyworks
Sergei Zhgoon, National Research University "MPEI" (Moscow Power Engineering Institute)
Yao Zhu, Institute of Microelectronics, A*STAR

Chair: Alessandro Stuart Savoia, Roma Tre University
Co-Chair: Levent Degertekin, Georgia Institute of Technology
Co-Chair: Xiaoning Jiang, NC State University

Martin Angerer, The University of British Columbia (UBC)
Enrico Boni, University of Florence
Dominique Certon, Francois Rabelais University of Tours
Jin Ho Chang, Daegu Gyeongbuk Institute of Science & Technology (DGIST)
Chi Tat (Harry) Chiu, GE Healthcare
David Cowell, University of Leeds
Jiyan Dai, The Hong Kong Polytechnic University
Charles Emery, Merz North America
Nicolas Felix, Vermon SA
Vittorio Ferrari, University of Brescia
Leela Goel, Shockwave Medical (J&J Medtech)
Anne-Christine Hladky, Institut Supérieur d'Electronique et du Numerique
Valsala Kurusingal, Thales Australia
Monica La Mura, Roma Tre University
Koko Lam, University of Glasgow
Holly Lay, Acoustiic Inc
Byung Chul Lee, Korea Institute of Science and Technology
Ho-Yong Lee, Ceracomp Co. Ltd
Franck Levassort, Francois Rabelais University of Tours
Xiang Li, ALS
Brooks Lindsey, Georgia Institute of Technology
Jessica Liu, Qualcomm Inc.
Baoqiang Liu, University of Southern California
Yipeng Lu, Peking University
Jianguo Ma, Beihang University
Chelsea Munding, Flosonics Medical
Richard O'Leary, University of Strathclyde
Omer Oralkan, NC State University
Chang Peng, ShanghaiTech University
Michiel Pertijs, Delft University of Technology
Weibao Qiu, Shenzhen Institutes of Advanced Technology
Wei Ren, Xi'an Jiaotong University
Stefan Rupitsch, University of Freiburg
Lei Sun, The Hong Kong Polytechnic University
Rob van Schaijk, Xiver
Shujun Zhang, University of Wollongong
Qifa Zhou, University of Southern California